·
|
Fourth quarter net revenues
increased 6.6% sequentially; 39.9% gross
margin
|
·
|
2010 net income of $830 million
on highest ever net revenues of $10.35
billion
|
·
|
Net financial position improved
$732 million in 2010 to $1.15
billion*
|
·
|
Record year for the full range
of ST’s “Sense and Power” portfolio, namely advanced analog and MEMS, as
well as microcontrollers and automotive
applications
|
Net Revenues By Market Segment
/ Channel (a)
(In %) |
Q4
2010
|
Q3
2010
|
Q4
2009
|
Market
Segment / Channel:
|
|||
Automotive
|
15%
|
14%
|
13%
|
Computer
|
14%
|
13%
|
14%
|
Consumer
|
11%
|
13%
|
11%
|
Industrial
& Other
|
8%
|
7%
|
7%
|
Telecom
|
31%
|
31%
|
36%
|
Total
OEM
|
79%
|
78%
|
81%
|
Distribution
|
21%
|
22%
|
19%
|
Operating
Segment
(In
Million US$)
|
Q4
2010
Net
Revenues
|
Q4
2010
Operating
Income
(Loss)
|
Q3
2010
Net
Revenues
|
Q3
2010
Operating
Income
(Loss)
|
Q4
2009
Net
Revenues
|
Q4
2009
Operating
Income
(Loss)
|
||||||||||||||||||
ACCI
(a)
|
1,128 | 135 | 1,086 | 128 | 980 | 62 | ||||||||||||||||||
IMS
(a)
|
1,131 | 254 | 1,012 | 199 | 871 | 85 | ||||||||||||||||||
Wireless
(b)
|
562 | (136 | ) | 546 | (94 | ) | 712 | (48 | ) | |||||||||||||||
Others
(c)(d)
|
12 | (40 | ) | 13 | (40 | ) | 20 | (105 | ) | |||||||||||||||
TOTAL
|
2,833 | 213 | 2,657 | 193 | 2,583 | (6 | ) |
In
Million US$
|
Full
Year 2010
|
Full
Year 2009
|
||||||||||||||
Product
Segment
|
Net
Revenues
|
Operating
Income
(Loss)
|
Net
Revenues
|
Operating
Income
(Loss)
|
||||||||||||
ACCI
|
4,169 | 410 | 3,152 | (69 | ) | |||||||||||
IMS
|
3,899 | 681 | 2,687 | 91 | ||||||||||||
Wireless
|
2,219 | (483 | ) | 2,585 | (356 | ) | ||||||||||
Others
|
59 | (132 | ) | 86 | (689 | ) | ||||||||||
TOTAL
|
10,346 | 476 | 8,510 | (1,023 | ) |
|
·
|
Power
Train
|
|
o
|
Key
design win in China for a full engine-control kit, including
microcontroller (MCU) and highly integrated ASIC, from a tier-one player
supplying all the major automotive OEMs in
China.
|
|
o
|
Design
win from a worldwide leader in hybrid/electric-vehicle (HEV/EV) batteries
to supply at least five major global car makers from 2013, for a
next-generation battery-manager ASIC (application-specific IC), embedding
new and innovative features.
|
|
o
|
Design
win for two variants of ST’s 32-bit automotive MCU from a leader for
engine-control systems in Europe, supplying three major global car makers
from 2013.
|
|
o
|
Tripartite
cooperation between ST, a major Chinese car maker and a major European
tier-one OEM to generate a next-generation direct-injection engine
platform that is compliant with Euro 5 and China 5 emission
standards.
|
|
·
|
Body
Electronics
|
|
o
|
Key
design wins for body-control module (BCM) applications, including: a win
for VIPower chips from a tier-one OEM in Japan; and a win for the SPC560B
32-bit MCU family from a US tier-one OEM for a major European
platform.
|
|
o
|
24V-focused
VIPower family gained strategically important design win from a worldwide
tier-one leader in body electronics for various truck
applications.
|
|
o
|
Design
win from a major European OEM for a full-solution door-zone
platform.
|
|
·
|
Safety
|
|
o
|
Design
win from a major OEM in Europe for an integrated-brake ASIC that has been
designed to complement all new electronic stability control units from
2013.
|
|
o
|
Further
design wins for ST’s 32-bit automotive MCU family for airbag and
integrated-safety controllers for production at two major premium-brand
car makers in Europe.
|
|
·
|
Infotainment
|
|
o
|
Key
design win for an OEM radio-navigation application for the Cartesio+
navigation processor, a tuner IC and a digital audio
processor.
|
|
o
|
Design
win for Teseo II, the first fully working single-chip IC for multiple
global navigation systems, to be integrated into a new Personal Navigation
Device (PND) for the market in
Russia.
|
|
o
|
Design
wins for audio chips for car-radio applications including: an advanced
digital class-D amplifier IC from a major consumer audio leader in Japan;
and a tuner IC for the next generation of premium radios from a leading US
audio maker.
|
|
·
|
Set-Top Boxes
(STBs)
|
|
o
|
Strengthened
leadership position with shipment of 10 million units of the
second-generation STi7105 and STi7105-derivative STB
decoders.
|
|
o
|
Ramped-up
new second-generation System-on-Chip (SoC) decoder ICs, including: the
STi7162 for high definition and the STi5262 for standard definition,
targeting free-to-air, cable and terrestrial STBs, as well as hybrid
products with added support for IPTV; and the STi7197 for the US cable
market.
|
|
o
|
Significant
new deployments of second-generation STB decoders achieved in Europe,
Asia, China, Middle East, India and South America, with more than 50
customers in production.
|
|
o
|
Enabled
next-generation hybrid broadcast/broadband convergence STB designs with 10
major designs for third-generation STi7108-based
STBs.
|
|
·
|
Integrated Digital TV
(iDTV)
|
|
o
|
Two
new design-ins for Freeman 100Hz single-chip 3DTV platforms for European
and emerging markets.
|
|
o
|
World’s
first demonstration to key customers of the Freeman Premier single-chip TV
SoC driving a 120Hz 3D TV, plus motion-judder reduction, on a
line-interleaved TV using ‘passive’
glasses.
|
|
o
|
Announced
and demonstrated support of Adobe Flash Access 2.0 along with Adobe AIR
for both STBs and TV on a Freeman SoC platform as part of the program for
delivering rich media content and applications to the
TV.
|
|
·
|
DisplayPort and
Monitors
|
|
o
|
Key
design wins: for the STDP4028/20 chipset from a key US-based OEM for a
video-wall display application (up to 25 displays) using DisplayPort
interface technology; and for the high-quality STDP5300H scaler chip from
a leading US OEM for the fast-growing All-In-One PC
application.
|
|
o
|
Demonstration
of ST’s new Mobility DisplayPort (MYDP) interface platform for efficient,
full-HD video and audio connectivity between mobile devices and TVs and
displays.
|
|
·
|
Audio
|
|
o
|
Shipments
began of a key Sound Terminal™ integrated digital audio processor and
amplifier IC to a leading maker of plasma TVs in
Korea.
|
|
·
|
Imaging
|
|
o
|
Design
win for an 8-megapixel image sensor from a tier-one mobile-phone maker.
The product will use ST’s latest high-performance pixel technology and
will be used in leading phones in 2011 and
2012.
|
|
o
|
Design
win for a cutting-edge ASIC, to be implemented in ST’s 32nm CMOS process
technology, from a major communication-infrastructure maker for a very
high-capacity networking switch
application.
|
|
o
|
ZT
Systems announced the first ARM-based computing server, for use in data
centers, that embeds ST’s leading-edge SPEAr1310 embedded microprocessor,
which is manufactured in low-power 55nm technology and combines two ARM
Cortex-A9 cores with a DDR3 memory
interface.
|
|
o
|
Announced
software development support for SPEAr embedded microprocessors from both
Green Hills Software and IAR.
|
|
·
|
MEMS (Micro-Electro-Mechanical
Systems)
|
|
o
|
3-axis
digital MEMS gyroscope in production for a leading tablet maker based in
Korea.
|
|
o
|
MEMS-based
digital microphones under qualification in notebook
PCs.
|
|
o
|
MEMS
e-compass now in volume production at smartphone maker in
China.
|
|
o
|
3-axis
analog MEMS gyroscope now under evaluation for next-generation games
platform.
|
|
o
|
Continued
supply of accelerometers and gyroscopes to the world’s leading consumer
brands.
|
|
o
|
Launched
new family of high-g acceleration sensors for advanced airbag
systems.
|
|
·
|
Sensors
|
|
o
|
Announced
cooperation with OMROM to provide solution for electronic gas-meter flow
sensors.
|
|
o
|
Launched
extremely small silicon pressure sensor for use in smartphones, sports
watches and other portable equipment, in addition to weather stations and
various automotive and industrial
applications.
|
|
o
|
Launched
S-Touch® FingerTip controller, offering smartphones
true multi-touch capability.
|
|
o
|
Ultra-sound
chip design-in at leading US medical equipment
maker.
|
|
o
|
Bio-sensor
now in volume production at medical company in the
US.
|
|
·
|
Analog
|
|
o
|
Increased
market penetration for micro-power op amps in applications such as glucose
meters, LED light bulbs and hard-disk drive
applications.
|
|
o
|
Sharp
growth in production demand for battery-monitoring ‘fuel gauge’ IC from
leading smartphone maker in Japan.
|
|
o
|
Design
wins increasing for ‘Rad-Hard’ (radiation-hardened) analog
ICs.
|
|
o
|
Launched
D-Spin platform, a new digital micro-stepping driver system-on-chip IC
with embedded motion controller now qualified and ready for mass
production.
|
|
o
|
Production
started for new DC/DC converter ICs for AMOLED (Active-Matrix Organic LED)
applications for a leading mobile-phone manufacturer in
Korea.
|
|
o
|
Design
wins including: converter ICs for major hard-disk-drive maker in the US;
and an ASIC for a leading gaming platform switched-mode power-supply
(SMPS) from a major OEM in Taiwan.
|
|
o
|
Launched
SPV1001 for solar panels, designed to allow more of the energy from each
cell to reach the power grid.
|
|
o
|
Design
win as the sole source for STarGRID™ power-line communication
SoCs for smart metering equipment from power utility company in
Spain.
|
|
o
|
Multiple
design wins for power transistors, including: MDmesh™ V MOSFETs for a
leading European maker of solar panels; MDmesh II MOSFETs for an important
games platform power supply; and STripFET™ MOSFETs for a DC/DC powered
telecom application in China.
|
|
o
|
Design
win for an IPM (Integrated Power Module) for a sewing-machine platform in
China.
|
|
o
|
Ramped-up
PowerFLAT™ packaged devices for computer
applications.
|
|
o
|
Continued
success with BC² diode kit providing solar inverters and SMPS applications
with improved efficiency by recycling the energy usually lost in these
type of circuits.
|
|
o
|
Extended
silicon-carbide (SiC) diode portfolio with a new range of devices ideal
for solar inverters and power
supplies.
|
|
o
|
Reinforced
leadership in high-junction-temperature Triacs with the first 30A 150°C
devices, ideal for motor-control and high-temperature-environment
applications.
|
|
o
|
Introduced
the most compact and flat packages for thyristors and AC-switch devices
that can save 55% of PCB space and offer footprint compatibility with the
SOT-223 package commonly used in home appliances, industrial and lighting
applications.
|
|
o
|
Extended
the highly successful STM32 family with the launch of the new STM32 F-2
series, the world’s first 90nm-Flash ARM Cortex-M3 MCU family, combining
very high performance and state-of-the-art low current consumption; and
simultaneously unveiled the further extension of the STM32 family to
include ARM Cortex-M0 and -M4
cores.
|
|
o
|
Design
win for the STM32W wireless (RF4CE protocol) MCU from Philips for its
‘Dual’ remote control, which includes a full QWERTY keyboard that provides
easier web and content access from the
TV.
|
|
o
|
Design
wins for the new 1-Mbyte-Flash Access/Performance Line of 32-bit STM32
MCUs at leading OEMs in consumer, healthcare and smart-metering
applications.
|
|
o
|
Applications
using the STM32 are now in production at a major telecom-equipment
manufacturer in China and at a major OEM in Europe for mobile-phone
accessories.
|
|
o
|
Ultra-low-power
8-bit STM8L in production in China for a new smart meter for a global
deployment program.
|
|
o
|
New
NFC (Near-Field Communication)-enabled MIFARE DESFire SIM card from
Oberthur Technologies, based on the highly secure ST33 MCU, on the MIFARE
DESFire Library developed by ST.
|
|
o
|
Design
wins gained at major smartcard manufacturers for an ST23 dual-interface
secure MCU with crypto-processor and 16-Kbyte EEPROM for use in government
and ID applications.
|
|
o
|
ST23
secure MCU with crypto-processor and 48-Kbyte 90nm embedded-EEPROM now in
production for customers in banking and pay-TV
applications.
|
|
o
|
Design
win for ST’s innovative dual-interface EEPROM for a consumer healthcare
product from a major OEM.
|
|
o
|
Launched
64-Kbit RFID memory for maintenance-history recording in industrial,
medical, automotive and avionics
equipment.
|
|
o
|
ST-Ericsson
announced it is joining forces with Nokia to drive TD-LTE in China. At
Expo 2010 Shanghai China, ST-Ericsson and Nokia demonstrated video
streaming and other multimedia services on a TD-LTE Nokia booklet
containing ST-Ericsson’s M700 TD-LTE modem.
|
|
o
|
ST-Ericsson
announced collaboration with Quanta Computer on LTE modules and USB
dongles. The partnership was highlighted by a live video demonstration on
a Quanta Computer tablet over the TD-LTE network at the closing ceremony
of Expo 2010 Shanghai, China.
|
|
o
|
Samsung
selected ST-Ericsson’s single G4906 GSM/GPRS platform for its Ch@t 322
Dual-SIM Dual-Standby mobile telephone, launched in Russia, the
Commonwealth of Independent States (CIS), Southeast Asia, India, China,
Middle East, and Africa.
|
|
o
|
Australian
telecommunication operator Telstra, together with Acer and Ericsson,
launched the first netbook with a built-in 21Mbps HSPA+ mobile-broadband
module, based on ST-Ericsson’s M570 thin
modem.
|
|
·
|
Changes in demand in the key
application markets and from key customers served by our products, which
make it extremely difficult to accurately forecast and plan our future
business activities. In particular, following a period of significant
order cancellations in 2009, we have over the last quarters, experienced a
strong surge in customer
demand,
|
|
|
which has led to capacity
constraints in certain applications; however, we may again in the
future, in case of excessive inventory at customers or distribution
channels, experience order
cancellations;
|
|
·
|
our ability to utilize and
operate our manufacturing facilities at sufficient levels to cover fixed
operating costs during periods of reduced customer demand, as well as our
ability to ramp up production efficiently and rapidly to respond to
increased customer demand, in an intensely cyclical and competitive
industry, and the financial impact of obsolete or excess inventories if
actual demand differs from our
expectations;
|
|
·
|
the operations of the
ST-Ericsson Wireless joint venture, which represents a significant
investment and risk for our business and which may lead to significant
additional impairment and restructuring charges, in the event ST-Ericsson
is unable to successfully compete in a rapidly changing and increasingly
competitive market;
|
|
·
|
our ability to compete in the
semiconductor industry since a high percentage of our costs are fixed and
are incurred in Euros and currencies other than U.S. dollars,
especially in light of the increasing volatility in the foreign exchange
markets and, more particularly, in the U.S. dollar exchange rate as
compared to the Euro and the other major currencies we use for our
operations;
|
|
·
|
the outcome of ongoing
litigation as well as any new litigation to which we may become a
defendant;
|
|
·
|
changes in our overall tax
position as a result of changes in tax laws or the outcome of tax audits,
and our ability to accurately estimate tax credits, benefits, deductions
and provisions and to realize deferred tax
assets;
|
|
·
|
the impact of intellectual
property (“IP”) claims by our competitors or other third parties, and our
ability to obtain required licenses on reasonable terms and
conditions;
|
|
·
|
product warranty or liability
claims based on epidemic failures or recalls by our customers for a
product containing one of our
parts;
|
|
·
|
our ability in an intensively
competitive environment to secure customer acceptance and to achieve our
pricing expectations for high-volume supplies of new products in whose
development we have been, or are currently,
investing;
|
|
·
|
availability and costs of raw
materials, utilities, third-party manufacturing services, or other
supplies required by our operations;
and
|
|
·
|
changes in the political,
social or economic environment, including as a result of military
conflict, social unrest and/or terrorist activities, economic turmoil, as
well as natural events such as severe weather, health risks, epidemics,
earthquakes, volcano eruptions or other acts of nature in, or affecting,
the countries in which we, our key customers or our suppliers,
operate.
|
Q4
2010
(US$
millions and cents per share)
|
Gross
Profit
|
Operating
Income
|
Net
Earnings
|
Corresponding
EPS
(diluted)
|
U.S.
GAAP
|
1,129
|
213
|
219
|
0.24
|
Impairment
& Restructuring
|
32
|
20
|
||
Loss
on sale of Micron shares
|
13
|
|||
Estimated
Income Tax Effect
|
(9)
|
|||
Non-U.S
GAAP
|
1,129
|
245
|
243
|
0.27
|
Q3
2010
(US$
millions and cents per share)
|
Gross
Profit
|
Operating
Income
|
Net
Earnings
|
Corresponding
EPS
(diluted)
|
U.S.
GAAP
|
1,041
|
193
|
198
|
0.22
|
Impairment
& Restructuring
|
27
|
18
|
||
Estimated
Income Tax Effect
|
(5)
|
|||
Non-U.S
GAAP
|
1,041
|
220
|
211
|
0.23
|
Q4
2009
(US$
millions and cents per share)
|
Gross
Profit
|
Operating
Income
(Loss)
|
Net
Earnings
(Loss)
|
Corresponding
EPS
(diluted)
|
U.S.
GAAP
|
957
|
(6)
|
(70)
|
(0.08)
|
Impairment
& Restructuring
|
96
|
65
|
||
Realized
losses on financial assets
|
68
|
|||
Estimated
Income Tax Effect
|
(27)
|
|||
Non-U.S
GAAP
|
957
|
90
|
36
|
0.04
|
Net
Financial Position (in US$ millions)
|
December
31,
2010
|
September
25,
2010
|
December
31,
2009 |
|||||||||
Cash
and cash equivalents, net of bank overdrafts
|
1,892 | 1,473 | 1,588 | |||||||||
Marketable
securities, current (a)
|
891 | 1,176 | 1,032 | |||||||||
Short-term
deposits
|
67 | 67 | - | |||||||||
Non-current
restricted cash
|
- | - | 250 | |||||||||
Marketable
securities, non-current (a)
|
72 | 64 | 42 | |||||||||
Total
financial resources
|
2,922 | 2,780 | 2,912 | |||||||||
Short-term
borrowings and current portion of long-term debt
|
(720 | ) | (717 | ) | (176 | ) | ||||||
Long-term
debt
|
(1,050 | ) | (1,185 | ) | (2,316 | ) | ||||||
Total
financial debt
|
(1,770 | ) | (1,902 | ) | (2,492 | ) | ||||||
Net
financial position
|
1,152 | 878 | 420 |
Net
Operating Cash Flow (in US$ millions)
|
Q4 2010 | Q3 2010 | Q4 2009 | |||||||||
Net
cash from operating activities
|
492 | 548 | 449 | |||||||||
Net
cash from (used in) investing activities
|
139 | (120 | ) | (207 | ) | |||||||
Payment
for purchases of (proceeds from sale of) current and
non-current marketable securities, short-term deposits and restricted
cash, net
|
(282 | ) | (204 | ) | 5 | |||||||
Net
operating cash flow
|
349 | 224 | 247 | |||||||||
Net
operating cash flow (ex M&A)
|
356 | 228 | 221 |
STMicroelectronics
N.V.
|
Consolidated
Statements of Income
|
(in
million of U.S. dollars, except per share data
($))
|
Twelve months ended |
||||||||
(Unaudited)
|
(Audited)
|
|||||||
December
31,
|
December
31,
|
|||||||
2010
|
2009
|
|||||||
Net
sales
|
10,262 | 8,465 | ||||||
Other
revenues
|
84 | 45 | ||||||
NET
REVENUES
|
10,346 | 8,510 | ||||||
Cost
of sales
|
(6,331 | ) | (5,884 | ) | ||||
GROSS
PROFIT
|
4,015 | 2,626 | ||||||
Selling,
general and administrative
|
(1,175 | ) | (1,159 | ) | ||||
Research
and development
|
(2,350 | ) | (2,365 | ) | ||||
Other
income and expenses, net
|
90 | 166 | ||||||
Impairment,
restructuring charges and other related closure costs
|
(104 | ) | (291 | ) | ||||
Total
Operating Expenses
|
(3,539 | ) | (3,649 | ) | ||||
OPERATING
INCOME (LOSS)
|
476 | (1,023 | ) | |||||
Other-than-temporary
impairment charge and realized losses on financial assets
|
- | (140 | ) | |||||
Interest
income (loss), net
|
(3 | ) | 9 | |||||
Loss
on equity investments and gain on investment divestiture
|
242 | (337 | ) | |||||
Loss
on financial instruments, net
|
(24 | ) | (5 | ) | ||||
INCOME
(LOSS) BEFORE INCOME TAXES
AND NONCONTROLLING INTEREST |
691 | (1,496 | ) | |||||
Income
tax benefit (expense)
|
(149 | ) | 95 | |||||
INCOME
(LOSS) BEFORE NONCONTROLLING INTEREST
|
542 | (1,401 | ) | |||||
Net
loss attributable to noncontrolling interest
|
288 | 270 | ||||||
NET
INCOME (LOSS) ATTRIBUTABLE TO PARENT COMPANY
|
830 | (1,131 | ) | |||||
EARNINGS
(LOSS) PER SHARE (BASIC) ATTRIBUTABLE TO PARENT COMPANY
SHAREHOLDERS
|
0.94 | (1.29 | ) | |||||
EARNINGS
(LOSS) PER SHARE (DILUTED) ATTRIBUTABLE TO PARENT COMPANY
SHAREHOLDERS
|
0.92 | (1.29 | ) | |||||
|
||||||||
NUMBER
OF WEIGHTED AVERAGE SHARES
USED IN CALCULATING DILUTED EARNINGS (LOSS) PER
SHARE
|
911.1 | 876.9 |
STMicroelectronics
N.V.
|
Consolidated
Statements of Income
|
(in
million of U.S. dollars, except per share data
($))
|
Three Months Ended |
||||||||
(Unaudited)
|
(Audited)
|
|||||||
December
31,
|
December
31,
|
|||||||
2010
|
2009
|
|||||||
Net
sales
|
2,810 | 2,570 | ||||||
Other
revenues
|
23 | 13 | ||||||
NET
REVENUES
|
2,833 | 2,583 | ||||||
Cost
of sales
|
(1,704 | ) | (1,626 | ) | ||||
GROSS
PROFIT
|
1,129 | 957 | ||||||
Selling,
general and administrative
|
(310 | ) | (303 | ) | ||||
Research
and development
|
(604 | ) | (603 | ) | ||||
Other
income and expenses, net
|
30 | 39 | ||||||
Impairment,
restructuring charges and other related closure costs
|
(32 | ) | (96 | ) | ||||
Total
Operating Expenses
|
(916 | ) | (963 | ) | ||||
OPERATING
INCOME (LOSS)
|
213 | (6 | ) | |||||
Other-than-temporary
impairment charge and realized losses on financial assets
|
- | (68 | ) | |||||
Interest
income (expense), net
|
(5 | ) | 3 | |||||
Loss
on equity investments
|
(10 | ) | (13 | ) | ||||
Gain
(loss) on financial instruments, net
|
(12 | ) | 3 | |||||
INCOME
(LOSS) BEFORE INCOME TAXES
AND NONCONTROLLING INTEREST |
186 | (81 | ) | |||||
Income
tax expense
|
(50 | ) | (48 | ) | ||||
INCOME
(LOSS) BEFORE NONCONTROLLING INTEREST
|
136 | (129 | ) | |||||
Net
loss attributable to noncontrolling interest
|
83 | 59 | ||||||
NET
INCOME (LOSS) ATTRIBUTABLE TO PARENT COMPANY
|
219 | (70 | ) | |||||
EARNINGS
(LOSS) PER SHARE (BASIC) ATTRIBUTABLE TO PARENT COMPANY
SHAREHOLDERS
|
0.25 | (0.08 | ) | |||||
EARNINGS
(LOSS) PER SHARE (DILUTED) ATTRIBUTABLE TO PARENT COMPANY
SHAREHOLDERS
|
0.24 | (0.08 | ) | |||||
NUMBER
OF WEIGHTED AVERAGE SHARES
USED IN CALCULATING DILUTED EARNINGS (LOSS) PER
SHARE
|
908.2 | 878.3 |
STMicroelectronics
N.V.
|
|||||||
CONSOLIDATED
BALANCE SHEETS
|
As
at
|
December
31,
|
September
25,
|
December
31,
|
|||||||||
In
million of U.S. dollars
|
2010
|
2010
|
2009
|
|||||||||
(Unaudited)
|
(Unaudited)
|
(Audited)
|
||||||||||
ASSETS
|
||||||||||||
Current
assets:
|
||||||||||||
Cash
and cash equivalents
|
1,892 | 1,473 | 1,588 | |||||||||
Restricted
cash
|
7 | 43 | - | |||||||||
Short-term
deposits
|
67 | 67 | - | |||||||||
Marketable
securities
|
1,052 | 1,556 | 1,032 | |||||||||
Trade
accounts receivable, net
|
1,230 | 1,424 | 1,367 | |||||||||
Inventories,
net
|
1,497 | 1,432 | 1,275 | |||||||||
Deferred
tax assets
|
218 | 219 | 298 | |||||||||
Assets
held for sale
|
28 | 29 | 31 | |||||||||
Other
receivables and assets
|
609 | 727 | 753 | |||||||||
Total
current assets
|
6,600 | 6,970 | 6,344 | |||||||||
Goodwill
|
1,054 | 1,060 | 1,071 | |||||||||
Other
intangible assets, net
|
731 | 747 | 819 | |||||||||
Property,
plant and equipment, net
|
4,046 | 3,868 | 4,081 | |||||||||
Long-term
deferred tax assets
|
329 | 375 | 333 | |||||||||
Equity
investments
|
133 | 143 | 273 | |||||||||
Restricted
cash
|
- | - | 250 | |||||||||
Non-current
marketable securities
|
72 | 165 | 42 | |||||||||
Other
investments and other non-current assets
|
384 | 378 | 442 | |||||||||
6,749 | 6,736 | 7,311 | ||||||||||
Total
assets
|
13,349 | 13,706 | 13,655 | |||||||||
LIABILITIES AND SHAREHOLDERS’
EQUITY
|
||||||||||||
Current
liabilities:
|
||||||||||||
Short-term
borrowings and current portion of long-term debt
|
720 | 717 | 176 | |||||||||
Trade
accounts payable
|
1,233 | 1,411 | 883 | |||||||||
Other
payables and accrued liabilities
|
1,004 | 1,140 | 1,049 | |||||||||
Dividends
payable to shareholders
|
62 | 123 | 26 | |||||||||
Deferred
tax liabilities
|
7 | 3 | 20 | |||||||||
Accrued
income tax
|
96 | 203 | 126 | |||||||||
Total
current liabilities
|
3,122 | 3,597 | 2,280 | |||||||||
Long-term
debt
|
1,050 | 1,185 | 2,316 | |||||||||
Reserve
for pension and termination indemnities
|
326 | 299 | 317 | |||||||||
Long-term
deferred tax liabilities
|
59 | 30 | 37 | |||||||||
Other
non-current liabilities
|
295 | 242 | 342 | |||||||||
1,730 | 1,756 | 3,012 | ||||||||||
Total
liabilities
|
4,852 | 5,353 | 5,292 | |||||||||
Commitment
and contingencies
|
||||||||||||
Equity
|
||||||||||||
Parent
company shareholders’
equity
|
||||||||||||
Common
stock (preferred stock: 540,000,000 shares authorized, not issued; common
stock: Euro 1.04 nominal value, 1,200,000,000 shares authorized,
910,420,305 shares issued,
881,686,303 shares outstanding)
|
1,156 | 1,156 | 1,156 | |||||||||
Capital
surplus
|
2,515 | 2,506 | 2,481 | |||||||||
Accumulated
result
|
3,241 | 3,022 | 2,723 | |||||||||
Accumulated
other comprehensive income
|
979 | 969 | 1,164 | |||||||||
Treasury
stock
|
(304 | ) | (304 | ) | (377 | ) | ||||||
Total
parent company shareholders' equity
|
7,587 | 7,349 | 7,147 | |||||||||
Noncontrolling
interest
|
910 | 1,004 | 1,216 | |||||||||
Total
equity
|
8,497 | 8,353 | 8,363 | |||||||||
Total
liabilities and equity
|
13,349 | 13,706 | 13,655 |
STMicroelectronics
N.V.
|
SELECTED
CASH FLOW DATA
|
Cash
Flow Data (in US$ millions)
|
Q4 2010 | Q3 2010 | Q4 2009 | |||||||||
Net
Cash from operating activities
|
492 | 548 | 449 | |||||||||
Net
Cash from (used in) investing activities
|
139 | (120 | ) | (207 | ) | |||||||
Net
Cash used in financing activities
|
(199 | ) | (246 | ) | (218 | ) | ||||||
Net
Cash increase (decrease)
|
419 | 205 | 12 | |||||||||
Selected
Cash Flow Data (in US$ millions)
|
Q4 2010 | Q3 2010 | Q4 2009 | |||||||||
Depreciation
& amortization
|
327 | 294 | 355 | |||||||||
Payment
for capital expenditures
|
(423 | ) | (298 | ) | (190 | ) | ||||||
Dividends
paid to shareholders
|
(62 | ) | (62 | ) | (27 | ) | ||||||
Change
in inventories, net
|
(65 | ) | (84 | ) | 11 |
STMicroelectronics
N.V.
|
||||
Date:
|
January
25, 2011
|
By:
|
/s/
Carlo
Ferro
|
|
Name:
|
Carlo
Ferro
|
|||
Title:
|
President
and Chief Executive Officer
and Sole Member of our Managing Board |